Automated tray transfer device for prevention of mixing post and pre-test dies, and method of using same

ABSTRACT

A method of sorting automated tray transfer trays includes detecting if a die remains in the tray. The method includes the ability to interrupt the automated tray transfer process to prevent mixing processed and unprocessed dice. An apparatus includes a sensor for detecting if a die remains in the tray. A sensor includes a protrusion on an automated tray transfer handler.

TECHNICAL FIELD

Disclosed embodiments relate to an automated tray transfer (ATT) trayhandler. More particularly, disclosed embodiments relate to a detectionsystem that interrupts the ATT process if a die has been left in a diepocket of a tray.

BACKGROUND INFORMATION

During testing of microelectronic dice, the dice are moved bypick-and-place mechanisms and advanced to further processing. Aplurality of dice is often tested in a die tray that includes severaldie pockets. After testing, the die tray is removed and stacked forfurther use with dice that are up-line from testing. Occasionally, a dieis not removed from a die pocket of a die tray, and tested devices arestacked on top of untested devices, which can result in “escapees” ofuntested devices.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to understand the manner in which embodiments are obtained, amore particular description of various embodiments briefly describedabove will be rendered by reference to the appended drawings.Understanding that these drawings depict only typical embodiments thatare not necessarily drawn to scale and are not therefore to beconsidered to be limiting of its scope, some embodiments will bedescribed and explained with additional specificity and detail throughthe use of the accompanying drawings in which:

FIG. 1A is a side elevation of an automated tray transfer (ATT)mechanism and a die tray, according to an embodiment;

FIG. 1B is a side cross section of the ATT mechanism depicted in FIG. 1Aduring further processing, according to an embodiment;

FIG. 2 is an elevational cross section of an ATT mechanism duringprocessing, according to an embodiment;

FIG. 3 is a plan of a die with keep off zones (KOZs) and probe landingzones (PLZs), depicted according to an embodiment;

FIG. 4 is a perspective elevation of an ATT mechanism during processingwith a die tray, according to an embodiment;

FIG. 5 is a perspective elevation of the ATT mechanism depicted in FIG.4 with the ATT mechanism inverted;

FIG. 6 is a method flow decision diagram according to variousembodiments; and

FIG. 7 is a schematic depiction of an ATT system, according to anembodiment.

DETAILED DESCRIPTION

The following description includes terms, such as upper, lower, first,second, etc. that are used for descriptive purposes only and are not tobe construed as limiting. The embodiments of a device or articledescribed herein can be manufactured, used, or shipped in a number ofpositions and orientations. The terms “microelectronic device,” “die,”and “processor” generally refer to the physical object that is the basicworkpiece that is transformed by various process operations into thedesired integrated circuit device. A die is usually singulated from awafer, and wafers may be made of semiconducting, non-semiconducting, orcombinations of semiconducting and non-semiconducting materials. A boardis typically a resin-impregnated fiberglass structure that acts as amounting substrate for the die.

Reference will now be made to the drawings wherein like structures willusually be provided with like reference designations. In order to showthe structure and process embodiments most clearly, the drawingsincluded herein are diagrammatic representations of embodiments. Thus,the actual appearance of the fabricated structures, for example in aphotomicrograph, may appear different while still incorporating theessential structures of embodiments. Moreover, the drawings show onlythe structures necessary to understand the embodiments. Additionalstructures known in the art have not been included to maintain theclarity of the drawings.

FIG. 1A is a side elevation of an automated tray transfer (ATT)mechanism 100 (also referred to as a “pickup head”) and a die tray (alsoreferred to as a “parts tray”), according to an embodiment. The ATTmechanism 100 includes a suction device 110 that is connectable to apneumatic system. A spacer foot 112 is disposed between a top header bar114 and a bottom foot bar 116. A plurality of probes 118 is disposedthrough the bottom foot bar 116 in preparation for determining whetheran obstruction such as an unremoved die has been encountered. In anembodiment, each of the plurality of probes 118 is referred to as asensor. In an embodiment, each of the plurality of probes 118 isreplaced by an optical sensor. In an embodiment, each of the pluralityof probes 118 is referred to as a mechanical sensor.

In addition to the ATT mechanism 100, a die tray 120 can be providedsuch that the ATT mechanism 100 is moved toward to the die tray 120. TheATT mechanism is alternatively referred to as a tray handler 100. Aplurality of die pockets 122 is disposed within the die tray 120.

As the ATT mechanism 100 is moved toward the die tray 120, at least oneprotrusion such as a plurality of probe tips 124, each connected with acorresponding probe of the plurality of probes 118, is aligned to extendinto the die pockets 122. In an embodiment, the each sensor includes aprobe 118 and a probe tip 124. FIG. 1A depicts a residual die 126 thatis an obstruction because it has not been removed from the die tray 120.

FIG. 1B is a side cross section of the ATT mechanism depicted in FIG. 1Aduring further processing, according to an embodiment. A given diepocket 122 of the die tray 120 depicts a residual die 126 such that theprobe tip 124 of the probe 118 encounters the residual die 126 as anobstruction. According to an embodiment, where the probe tip 124 isimmovable, a process jam occurs and an operator may be alerted in orderto remove the residual die 126 such that it does not get mixed with dicethat have a different test status from the residual die 126.

FIG. 2 is an elevational cross section of an ATT mechanism 200 duringprocessing, according to an embodiment. The ATT mechanism 200 includes asuction device 210 that is connectable to a pneumatic system. A spacerfoot 212 is disposed between a top header bar 214 and a bottom foot bar216. A plurality of probes 218 are disposed through the bottom foot bar216 in preparation for determining whether an obstruction such as anunremoved die has been encountered.

In addition to the ATT mechanism 100, a die tray 220 can be providedsuch that the ATT mechanism 100 is moved toward to the die tray 220. Aplurality of die pockets 222 is disposed within the die tray 220. As theATT mechanism 200 is moved toward the die tray 220, a plurality of probetips 224, each connected with a corresponding the probes 218, is alignedto extend into the die pockets 222. FIG. 1A depicts a residual die 226that has not been removed from the die tray 220.

In an embodiment where any of the probe tips 224 is sensitive such thatit is movable, the residual die 226 and the site of its location in thedie tray 220 within a given die pocket 222, is memorialized such as byan automated write statement to a database, such that detection of theobstruction is done by automation. Accordingly, a given probe tip 224′that encounters an obstruction that is the residual die 226, isdistinguishable from the plurality of probe tips 224 that extend intorespective die pockets 222 and that do not encounter obstructions.

According to an embodiment, if the probe is optionally not used tomemorialize the die-pocket site, a process jam occurs and an operatormay be alerted in order to remove the residual die 226.

Where the die-pocket site can be memorialized, according to anembodiment, and where the residual die 226 was part of a die lot thathas already met the sample test criteria for this stage of the process,the process may continue by moving the die tray 220 with the ATTmechanism 200 by use of the suction device 210.

Where the sample test criteria for the residual die 226 has not beenmet, a process jam occurs and an operator may be alerted to remove theresidual die 226.

FIG. 3 is a plan of a residual die 326 with keep off zones (KOZs) 328and probe landing zones (PLZs) 330, depicted according to an embodiment.A KOZ is a region on a die surface that is to avoid any contact with aprobe, which could damage the die in this region. A PLZ is a region on adie that can sustain a test probe touching it, which allows for probetesting of the die. Because each die has specific KOZs 328, it is usefulto have the probe tip encounter the die in regions other than the KOZs328. The residual die 326 depicts a probe tip landing pad 330 thatallows for the probe tip to encounter the residual die 326 when it is anobstruction that is left within a die tray.

FIG. 4 is a perspective elevation of an ATT mechanism 400 duringprocessing with a die tray 420, according to an embodiment. The ATTmechanism 400 includes a suction device 410 that is connectable to apneumatic system. A spacer foot 412 is disposed between a top header bar414 and a bottom foot bar 416. A plurality of probes 418 are disposedthrough the bottom foot bar 416 in preparation for determining whetheran obstruction such as an unremoved die has been encountered.

In an embodiment in addition to the ATT mechanism 400, a die tray 420 isprovided such that the ATT mechanism 400 is moved toward to the die tray420. A plurality of die pockets 422 is disposed within the die tray 420.As the ATT mechanism 400 is moved toward the die tray 420, a pluralityof probe tips 424 (see FIG. 5), each connected with the probes 418, isaligned to extend into the die pockets 422. FIG. 1A depicts a residualdie 426 that has not been removed from the die tray 420.

FIG. 5 is a perspective elevation of the ATT mechanism 400 depicted inFIG. 4 with the ATT mechanism inverted. Accordingly, the suction device410 is at the nethermost location of the ATT mechanism 400 as depicted.The plurality of probe tips are provided as two probe tips percorresponding die pocket of a 10-die pocket die tray, one of which isdesignated by the reference numeral 424. The spacer foot 412 is disposedbetween the top header bar 414 and the bottom foot bar 416. Theplurality of probes 418 (depicted in phantom lines) is disposed throughthe bottom foot bar 416 in preparation for determining whether anobstruction has been encountered such as an unremoved die.

FIG. 6 is a method flow decision diagram 600 according to variousembodiments.

At 610, the method includes moving the ATT mechanism toward a die tray.

At 612, the method includes a query whether the probe encounters anobstruction. If an obstruction is encountered, a process jam and/or anoperator alert occurs at 614. Accordingly, an operator may be alerted inorder to locate the obstruction, particularly if the obstruction is amicroelectronic die.

At 620, the method includes removing the obstruction from the die tray.In an embodiment, the method includes an operator being the agent whoremoves the obstruction. In an embodiment, the obstruction is a die.

At 630, the method includes moving the die tray with respect to thelocation of the test handler.

FIG. 7 is a schematic depiction of an ATT system 700, according to anembodiment. The system 700 according to an embodiment includes a devicesuch as a reliable-fast-small (RFS®) test handler 710, manufactured byDelta Design, of San Diego, Calif., that includes an input auto traylift 712, an auto tray buffer 714, a plurality of sort auto tray lifts716, and a dump 718. In an embodiment, a computing system 720 is adevice such as a desktop computer that is electrically coupled 722 tothe RFS test handler 710. The computing system 720 can include inputmechanisms such as a keyboard 724 and a mouse 726 and an output devicesuch as a monitor 728.

In an embodiment, the ATT mechanism is referred to as a tray handler.Accordingly, the tray handler is coupled with a die tray that includes adie pocket. A sensor on the tray handler is a device such as the probeand/or the probe tip as set forth in this disclosure. Accordingly, theprobe tip may be a protrusion that is extendable into a die pocket of atray if the die pocket is devoid of an obstruction, but the sensor mayalso be an optical sensor that similarly detects whether a die pocket ofa die tray is devoid of an obstruction.

Where the sensor is a protrusion, such as a probe tip, the tray handleris configured to include the protrusions being aligned away from a KOZof a die that is placeable as the obstruction in the die pocket. In anembodiment, the die pocket is part of a plurality of 10 die pockets andaccordingly, the protrusion is part of a plurality of 20 probe tips asset forth in this disclosure. Similarly according to an embodiment,where the die pocket is part of a plurality of n die pockets, theprotrusion is part of a plurality of 2n protrusions, and each die pocketof the plurality of n die pockets corresponds to two protrusions of theplurality of 2n protrusions.

The Abstract is provided to comply with 37 C.F.R. §1.72(b) requiring anAbstract that will allow the reader to quickly ascertain the nature andgist of the technical disclosure. It is submitted with the understandingthat it will not be used to interpret or limit the scope or meaning ofthe claims.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the claimed embodiments of the inventionrequire more features than are expressly recited in each claim. Rather,as the following claims reflect, inventive subject matter lies in lessthan all features of a single disclosed embodiment. Thus the followingclaims are hereby incorporated into the Detailed Description, with eachclaim standing on its own as a separate preferred embodiment.

It will be readily understood to those skilled in the art that variousother changes in the details, material, and arrangements of the partsand method stages which have been described and illustrated in order toexplain the nature of this invention may be made without departing fromthe principles and scope of the invention as expressed in the subjoinedclaims.

1. An apparatus comprising: a tray handler including a suction device,wherein the tray handler is coupleable by the suction device with a dietray with a die pocket; and a sensor on the tray handler, wherein thesensor detects whether the die pocket contains a residual die, andwherein the sensor includes a protrusion that is extendable into a diepocket of a die tray if the die pocket is devoid of a residual die. 2.The apparatus of claim 1, further including a die tray with a diepocket.
 3. The apparatus of claim 1, further including a die tray with aplurality of die pockets.
 4. The apparatus of claim 1, wherein thesensor facilitates memorializing a die-pocket location that correspondsto the residual die.
 5. An apparatus comprising: a tray handlerincluding a suction device, wherein the tray handler is coupleable bythe suction device with a die tray with a die pocket; a die tray with adie pocket; and a sensor on the tray handler, wherein the sensor detectswhether the die pocket contains a residual die, wherein the sensorincludes a protrusion that is extendable into a die pocket of a tray ifthe die pocket is devoid of a residual die, and wherein the protrusionis disposed on the tray handler at a location that is aligned away froma keep-out zone of a die that is placeable as an obstruction in the diepocket.
 6. The apparatus of claim 5, wherein the die pocket is part of aplurality of die pockets of a die tray, and wherein the protrusion ispart of a plurality of protrusions.
 7. The apparatus of claim 5, whereinthe die pocket is part of a plurality of die pockets of a die tray,wherein the protrusion is part of a plurality of protrusions, andwherein each die pocket of the plurality of die pockets in the die traycorresponds to a protrusion of the plurality of protrusions.
 8. Anapparatus comprising: a tray handler including a suction device, whereinthe tray handler is coupleable by the suction device with a die traywith a die pocket; a die tray with a die pocket; and a sensor on thetray handler, wherein the sensor detects whether the die pocket containsa residual die, wherein the sensor includes a protrusion that isextendable into the die pocket of a die tray if the die pocket is devoidof a residual die wherein the die pocket is part of a plurality of n diepockets, wherein the protrusion is part of a plurality of 2 nprotrusions, and wherein each die pocket of the plurality of n diepockets in the die tray corresponds to two protrusions of the pluralityof 2 n protrusions.
 9. The apparatus of claim 8, wherein the sensorfacilitates memorializing a die-pocket location that corresponds to theresidual die.
 10. The apparatus of claim 8, wherein the sensorfacilitates memorializing a die-pocket location that corresponds to theresidual die, and wherein memorializing includes electronic storage ofthe die-pocket location.
 11. The apparatus of claim 8, further includinga die tray with a plurality of die pockets.
 12. An apparatus comprising:a tray handler including a suction device, wherein the tray handler iscoupleable by the suction device with a die tray with a die pocket; adie tray with a die pocket; and a sensor on the tray handler, whereinthe sensor detects whether the die pocket contains a residual die,wherein the sensor includes a plurality of protrusions that areextendable into the die pocket of a die tray if the die pocket is devoidof a residual die, and wherein the sensor facilitates memorializing adie-pocket location that corresponds to the residual die, and whereinmemorializing includes electronic storage in a personal computer of thedie-pocket location.
 13. The apparatus of claim 12, further including adie tray with a plurality of die pockets.
 14. The apparatus of claim 12,wherein the die pocket is part of a plurality of die pockets of a dietray, wherein the protrusion is part of a plurality of protrusions, andwherein each die pocket of the plurality of die pockets in the die traycorresponds to a protrusion of the plurality of protrusions.